Uniform Control of Wafer Temperature
Using the Remote SP (RSP) as the Set Value (SV) to equalize the temperature of the wafer.
Uniform Control of Wafer Temperature Read More »
Using the Remote SP (RSP) as the Set Value (SV) to equalize the temperature of the wafer.
Uniform Control of Wafer Temperature Read More »
Using cascade control and PID bank function to restrict the upper limit of the remote SP.
Cascade Control Using PID Banks Read More »
Register two SVs (one for idling, one for operation) in the Temperature Controller. Use buttons on the control panel to change all Temperature Controller settings during production.
Hot Melt Application System Read More »
Problems: Furnaces are located near power supply, so ambient operating temperature is 50°C, and a power supply with a greater capacity than normal is required (derating curve). The number of fans and capacity often changes. Use an S8TS Switching Power Supply that can be easily expanded in 660-W blocks. Respond quickly to sudden need for
Power Supply Standardization Read More »
The mirror reflection model inspects surface wobbling in mirror-finish objects at a resolution as high as 0.25 µm at the edge of the table, where the change is greatest.
Detects Surface Wobbling of Disk Motors Read More »
This application uses a pipe-mounting Capacitive Liquid-level Sensor that is not affected by the color of the pipe, the color of the liquid, or foams on the liquid surface. This Sensor allows you to detect chemical liquid levels without being affected by the color of the pipe, the color of the liquid or foams on
Detects Even Slight Difference in Liquid Level Through Pipe Read More »
K8AB-VS voltage relay is used to check battery voltage and its charge level.
Checks Battery Voltage Read More »
A submersible pump must be turned OFF as soon as it begins to operate out of water, or it will immediately malfunction. Instantaneous detection of this kind of idle operation is essential.
Protection against Idle Running of a Submersible Pump Read More »
Problem: Until now, in the production of DRAM, for example, wafers have usually been processed in lots of 25 (i.e., in wafer carrier units). The switch, however, towards high-diversity, low-volume production (e.g., custom LSI) has made individual wafer control necessary. In order to avoid reducing the number of IC chips produced per wafer, the markings
Individual Wafer Control Read More »