Industrial Process Automation

Height and width errors in foaming rise are measured together within the line beam.

Enables optimal roll pitch correction by precisely measuring the displacement amount of roller brackets.

2D Profile Measuring Smart Sensor detects PCB warping with a single measurement. Three-point height differences can be measured within the line beam, for PCB warping detection with a single measurement.

By measuring the height differences between two points, warped products that may cause contact defects in the mounting process can be eliminated.

Four measurement points can be calculated at high speed with a Multi-Controller to enable inline, non-contact inspection of all units on the line.

The Smart Monitor allows measurement data to be collected and stored on a personal computer.

The laser enables eccentricity to be precisely measured from a distance.

One Controller connects to four compact Pressure Sensors. Increase wafer throughput with little installation space.

Flexibly handles changes in text that occur on production sites. Increases production efficiency by eliminating false negatives.

Inspections for correct dates is possible while inspecting for light, chipped, or disarrayed characters.